BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change+0.00 (+0.00%) Bid99.18% Ask99.24% Last updateJul 09, 2026
06:51:13.676
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
4.30%
Bid
99.18
Ask
99.24
Diff. %
+0.00%
Coupon type
Fixed
Last update
Jul 09, 2026
06:51:13.676