BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change+0.03 (+0.03%) Bid99.12% Ask99.26% Last updateOct 07, 2026
14:00:50.333
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
4.87%
Bid
99.12
Ask
99.26
Diff. %
+0.03%
Coupon type
Fixed
Last update
Oct 07, 2026
14:00:50.333