BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change+0.02 (+0.03%) Bid- Ask- Last updateFeb 12, 2026
20:45:52.922
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
3.81%
Bid
-
Ask
-
Diff. %
+0.03%
Coupon type
Fixed
Last update
Feb 12, 2026
20:45:52.922