BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change-0.12 (-0.14%) Bid- Ask- Last updateSep 09, 2026
19:45:46.579
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Fin. Institutions
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
6.12%
Bid
-
Ask
-
Diff. %
-0.14%
Coupon type
Fixed
Last update
Sep 09, 2026
19:45:46.579