BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change+0.26 (+0.29%) Bid- Ask- Last updateJul 24, 2026
19:45:33.110
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Fin. Institutions
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
6.04%
Bid
-
Ask
-
Diff. %
+0.29%
Coupon type
Fixed
Last update
Jul 24, 2026
19:45:33.110