BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change-0.18 (-0.18%) Bid94.82% Ask95.36% Last updateFeb 24, 2026
10:00:55.137
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.43%
Bid
94.82
Ask
95.36
Diff. %
-0.18%
Coupon type
Fixed
Last update
Feb 24, 2026
10:00:55.137