BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change+0.33 (+0.35%) Bid- Ask- Last updateDec 23, 2025
20:45:42.675
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.47%
Bid
-
Ask
-
Diff. %
+0.35%
Coupon type
Fixed
Last update
Dec 23, 2025
20:45:42.675