BOND T MOBILE USA INC 5.25% SNR 15/06/2055 USD
Change+0.23 (+0.27%) Bid- Ask- Last updateJul 03, 2026
19:45:44.330
UTC
ISIN
US87264ADN28
Issuer
T-Mobile USA Inc.
Issuer type
Companies
Issuer country
USA
Coupon
5.25%
Currency
USD
Maturity date
Jun 15, 2055
Yield to maturity
6.24%
Bid
-
Ask
-
Diff. %
+0.27%
Coupon type
Fixed
Last update
Jul 03, 2026
19:45:44.330