BOND HP INCORPORATION 2.2% SNR 17/06/2025 USD1000
Change-0.07 (-0.07%) Bid- Ask- Last updateJul 30, 2024
15:30:24.818
UTC
ISIN
US40434LAA35
Issuer
HP Inc.
Issuer type
Companies
Issuer country
USA
Coupon
2.20%
Currency
USD
Maturity date
Jun 17, 2025
Yield to maturity
5.50%
Bid
-
Ask
-
Diff. %
-0.07%
Coupon type
Fixed
Last update
Jul 30, 2024
15:30:24.818