BOND HP INCORPORATION 3.4% SNR 17/06/2030 USD1000
Change+0.06 (+0.06%) Bid91.86% Ask93.26% Last updateJul 30, 2024
15:44:59.903
UTC
ISIN
US40434LAC90
Issuer
HP Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.40%
Currency
USD
Maturity date
Jun 17, 2030
Yield to maturity
4.93%
Bid
91.86
Ask
93.26
Diff. %
+0.06%
Coupon type
Fixed
Last update
Jul 30, 2024
15:44:59.903