BOND JPMORGAN CHASE & CO. 3.875% SUB 10/09/24 USD2000
Change-0.01 (-0.01%) Bid99.74% Ask99.87% Last updateJul 31, 2024
13:16:22.232
UTC
ISIN
US46625HJY71
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
3.88%
Currency
USD
Maturity date
Sep 10, 2024
Yield to maturity
6.64%
Bid
99.74
Ask
99.87
Diff. %
-0.01%
Coupon type
Fixed
Last update
Jul 31, 2024
13:16:22.232