BOND QUALCOMM INC 3.45% SNR 20/05/25 USD2000
Change-0.01 (-0.01%) Bid- Ask- Last updateJul 19, 2024
15:31:09.712
UTC
ISIN
US747525AF05
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.45%
Currency
USD
Maturity date
May 20, 2025
Yield to maturity
5.34%
Bid
-
Ask
-
Diff. %
-0.01%
Coupon type
Fixed
Last update
Jul 19, 2024
15:31:09.712