BOND QUALCOMM INC 4.65% SNR 20/05/35 USD1000
Change-0.56 (-0.56%) Bid- Ask- Last updateJul 19, 2024
15:30:32.365
UTC
ISIN
US747525AJ27
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
4.65%
Currency
USD
Maturity date
May 20, 2035
Yield to maturity
4.83%
Bid
-
Ask
-
Diff. %
-0.56%
Coupon type
Fixed
Last update
Jul 19, 2024
15:30:32.365