BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change-0.03 (-0.03%) Bid99.10% Ask99.29% Last updateOct 09, 2026
07:31:37.403
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
4.82%
Bid
99.10
Ask
99.29
Diff. %
-0.03%
Coupon type
Fixed
Last update
Oct 09, 2026
07:31:37.403