BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change+0.04 (+0.04%) Bid99.30% Ask99.43% Last updateDec 18, 2025
20:45:47.746
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
3.88%
Bid
99.30
Ask
99.43
Diff. %
+0.04%
Coupon type
Fixed
Last update
Dec 18, 2025
20:45:47.746