BOND QUALCOMM INC 3.25% SNR 20/05/27 USD2000
Change-0.08 (-0.08%) Bid99.36% Ask99.50% Last updateFeb 06, 2026
20:46:00.285
UTC
ISIN
US747525AU71
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.25%
Currency
USD
Maturity date
May 20, 2027
Yield to maturity
3.80%
Bid
99.36
Ask
99.50
Diff. %
-0.08%
Coupon type
Fixed
Last update
Feb 06, 2026
20:46:00.285