BOND HP INCORPORATION 2.2% SNR 17/06/2025 USD1000
Change+0.09 (+0.09%) Bid97.17% Ask97.45% Last updateJul 29, 2024
15:30:11.098
UTC
ISIN
US40434LAA35
Issuer
HP Inc.
Issuer type
Companies
Issuer country
USA
Coupon
2.20%
Currency
USD
Maturity date
Jun 17, 2025
Yield to maturity
5.50%
Bid
97.17
Ask
97.45
Diff. %
+0.09%
Coupon type
Fixed
Last update
Jul 29, 2024
15:30:11.098