BOND HP INCORPORATION 3.4% SNR 17/06/2030 USD1000
Change+0.02 (+0.02%) Bid90.82% Ask92.80% Last updateJul 29, 2024
15:44:59.864
UTC
ISIN
US40434LAC90
Issuer
HP Inc.
Issuer type
Companies
Issuer country
USA
Coupon
3.40%
Currency
USD
Maturity date
Jun 17, 2030
Yield to maturity
4.93%
Bid
90.82
Ask
92.80
Diff. %
+0.02%
Coupon type
Fixed
Last update
Jul 29, 2024
15:44:59.864