BOND HP INCORPORATION 4.75% SNR 15/01/28 USD1000
Change+0.01 (+0.01%) Bid99.92% Ask100.29% Last updateJul 29, 2024
15:30:59.764
UTC
ISIN
US40434LAM72
Issuer
HP Inc.
Issuer type
Companies
Issuer country
USA
Coupon
4.75%
Currency
USD
Maturity date
Jan 15, 2028
Yield to maturity
4.80%
Bid
99.92
Ask
100.29
Diff. %
+0.01%
Coupon type
Fixed
Last update
Jul 29, 2024
15:30:59.764