BOND QUALCOMM INC 5.4% SNR 20/05/2033 USD1000
Change-0.44 (-0.42%) Bid- Ask- Last updateJul 19, 2024
15:30:52.415
UTC
ISIN
US747525BS17
Issuer
QUALCOMM Inc.
Issuer type
Companies
Issuer country
USA
Coupon
5.40%
Currency
USD
Maturity date
May 20, 2033
Yield to maturity
4.74%
Bid
-
Ask
-
Diff. %
-0.42%
Coupon type
Fixed
Last update
Jul 19, 2024
15:30:52.415