BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change+0.11 (+0.11%) Bid94.91% Ask95.37% Last updateJul 31, 2024
10:02:23.257
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.42%
Bid
94.91
Ask
95.37
Diff. %
+0.11%
Coupon type
Fixed
Last update
Jul 31, 2024
10:02:23.257