BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change+0.47 (+0.54%) Bid88.41% Ask88.78% Last updateAug 25, 2026
17:00:47.344
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Fin. Institutions
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
6.10%
Bid
88.41
Ask
88.78
Diff. %
+0.54%
Coupon type
Fixed
Last update
Aug 25, 2026
17:00:47.344