BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change-0.16 (-0.18%) Bid- Ask- Last updateJul 10, 2026
19:47:15.705
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.86%
Bid
-
Ask
-
Diff. %
-0.18%
Coupon type
Fixed
Last update
Jul 10, 2026
19:47:15.705