BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change+0.49 (+0.54%) Bid- Ask- Last updateMay 26, 2026
19:45:32.677
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.81%
Bid
-
Ask
-
Diff. %
+0.54%
Coupon type
Fixed
Last update
May 26, 2026
19:45:32.677