BOND JPMORGAN CHASE & CO. 4.95% SUB 01/06/45 USD2000
Change-0.22 (-0.23%) Bid- Ask- Last updateDec 19, 2025
20:45:50.998
UTC
ISIN
US46625HLL23
Issuer
JPMorgan Chase & Co.
Issuer type
Companies
Issuer country
USA
Coupon
4.95%
Currency
USD
Maturity date
Jun 01, 2045
Yield to maturity
5.49%
Bid
-
Ask
-
Diff. %
-0.23%
Coupon type
Fixed
Last update
Dec 19, 2025
20:45:50.998