BOND SPIRE INC 6.25%-FRN SUB 01/06/56 USD
Change+0.08 (+0.08%) Bid- Ask- Last updateMay 22, 2026
19:46:54.480
UTC
ISIN
US84857LAD38
Issuer
Spire Inc.
Issuer type
Companies
Issuer country
USA
Coupon
6.25%
Currency
USD
Maturity date
Jun 01, 2056
Yield to maturity
-
Bid
-
Ask
-
Diff. %
+0.08%
Coupon type
Variable
Last update
May 22, 2026
19:46:54.480